Quote from: DiabloD3 on September 17, 2013, 02:30:44 PM

IBM is actually producing 22nm on their process for the next POWER series which available for order next year. TSMC and GloFo won't have 22nm until 2015 or 2016.

Well that is why I said only Intel is producing. It was to highlight that Intel is "special" and gets to play by their own rules (and that has annihilated AMD margins). I know you know that but a noob might see an Intel 14nm announcement and assume that means there will be 14nm SHA-2 ASICs "soon".

As for TSMC and 20nm it is always hard to say with the secrecy and NDA but it is looking like TSMC will have some 20nm capacity in 2014.

http://www.xbitlabs.com/news/other/display/20130806234800_TSMC_Slightly_Reschedules_Volume_Production_Using_20nm_Process_Technology_to_Early_2014.html

Everything is estimates and should be taken with a grain of salt but the estimates are moving sooner not later. If the rumors are true though GF is struggling with 20nm. However as we know having x nm capacity doesn't mean it is cost effective. Nobody is going to buy 20nm Bitcoin ASICs if they cost 3x as much just because they are 20nm. So it likely will be a "while" (2017 or later) before that becomes economical even if it is possible earlier. The need for "double exposure" at 22nm/20nm is going to create a serious cost wall even once the marignal cost of production is significantly lower than 28nm. It will be a high risk venture to because by the every ASIC company will be pushing 28nm product out the door with next day shipping. Nobody is going to accept 3-6 month preorders and the huge NRE costs means a company making the jump to 22nm/20nm will need to roll out massive volume to ammortize the NRE and still remain competitive. This time it will be the company not customers taking the risk.