I've looked at some calculations, if we assume the 10A is spread out across all vias and traces, 0.3mm will handle 1/2 an amp safely, most of the pads have 2 traces supplying Vint. I have no idea how well Vint is spread out internally in the die.
To increase tolerances, we can goto a slightly thicker top layer, the only real way to test if we can continue to use 35um is probably to manufacture one test piece.
So will you do that test piece for the power supply or shall somebody else do this ?
The main purpose of using the LMZ modules is so that we wouldn't have to do this, I have real life experience with these modules already, and I know they work as advertised, if anyone still wants to make a test PSU, I can ship out some LMZ modules for free to cut down on costs (this are like $15 a pop), eval kits are also available if you just wanna see how well they work.
I propose we route out the rest of the board, make a test batch of PCBs and then I can populate the board with say 1 FPGA to cut down on costs, and then ship them out to software devs who can then figure out what to do with the MCU and FPGA coding. Right now I'm not too worried about the hardware design, I can see active development, but no software dev has stepped up to offer help just yet (or maybe I'm just missing their posts). I'm no good with MSP430s just yet, so I can't help here.