Quote from: fpgaminer on December 01, 2013, 08:12:37 AM

@vs3, I'm not much of an analog guy, but isn't it difficult for a QFN package to evenly distribute 50 watts of clean power? I was under the impression that BGA style packages are used for A) large pin counts, and B) power distribution. Point B being salient here. BGAs allow you to get caps closer to the die. And with designs like mining chips, power distribution is key.

Again, I'm not an analog guy. I suppose BlackArrow could chime in here, but honestly I think they have more important things on their mind. Time to market is so much more important than getting the cost of PCB and assembly down.

I agree - each package has its pros and cons and our discussion may already be pointless if the package has been picked.
As for the caps - indeed, you can put them on the other side of the PCB and get them very close, but I don't think they're a critical piece here...

I think the biggest issue is dealing with all of that amperage and the resulting heat. (And if we have to route 40A through a hole bunch of vias - those would have to have one hell of a copper metallization ... I suspect even regular 1oz copper may not be sufficient)

BlackArrow - please chime in