Quote from: fizzisist on August 04, 2011, 03:19:58 PM

[...]
I added most parts from the FPGA, PSU, and MCU schematics to the BOM database. I also created BOMs for each. A few questions that came up while doing this:

1) Surface mount power connectors? These would really be much better as through-hole, for strength.

There are currently only SMD connectors, but as li_gangyi already pointed out these should be changed (in some cases: changed back) to through-hole. I just haven't done it, yet.

Quote from: fizzisist on August 04, 2011, 03:19:58 PM

2) I think I remember li_gangyi asking us to keep components above 0402 (1005 metric). Can these little guys be switched to 0603 or larger? For prototyping and debugging, it's also better to keep things larger (easier to probe and rework if needed).

That is a bit problematic: the Xilinx PCB design guide calls for 0402 imperial size caps. Does anyone have a good feel what happens if that size is changed? If the caps should stay 0402, then my second question is: does it make sense to keep the 0402 caps for the FPGAs but make all other 0402 size devices larger (for the MCU for example) or is there no extra difficulty on using more 0402 packages than absolutely necessary?

Quote from: fizzisist on August 04, 2011, 03:19:58 PM

3) Are we using the LMZ22010 or the LMZ12010? I'm seeing some confusion in the various schematics here. The difference between the two seems to be the SYNC pin, which we aren't using, so I don't see why we shouldn't use the cheaper one.
[...]

Didn't even notice that. The thing had different names in the library: the symbol was called LMZ22... and the device LMZ12... I just selected the symbol name to open the datasheet and then renamed the device. As far as I can see the current design is fit for both devices, though: pin 3 (the only difference between the devices) is grounded, which it needs to be in both cases. For the LMZ22..., it also needs to be grounded because we do not connect a frequency source.