KnC is using 4 dies in one package, so our chip is very close to what they have done. Our chip with 4 dies would be 120 GH/s. We are working on increasing the number of cores.
Ken,
How many die would you package per chip and how many chips per board? Die Size?
Do we know estimated power requirements yet for the 28nm @ 30GH/s.
If you say you are considering leaping to 20nm; what gains do you anticipate from this and at what costs (NRE, time, etc). Help us to understand your thoughts; don't leave people assuming that you aren't fully considering everything in your analysis.
Thanks,
Shao