Quote from: shaofis on February 06, 2014, 02:25:57 PM

Quote from: kslaughter on February 06, 2014, 12:40:58 AM

KnC is using 4 dies in one package, so our chip is very close to what they have done. Our chip with 4 dies would be 120 GH/s. We are working on increasing the number of cores.

Ken,

How many die would you package per chip and how many chips per board? Die Size?

Over 9000! Die size: ~wafer size/9000 Cool

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Do we know estimated power requirements yet for the 28nm @ 30GH/s.

98% of total draw power, with Intelliwatt(tm) set to "Max Money" Cool

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If you say you are considering leaping to 20nm; what gains do you anticipate from this and at what costs (NRE, time, etc). Help us to understand your thoughts; don't leave people assuming that you aren't fully considering everything in your analysis.
...

28nm = moar profit. Ken is your captain. FUD-spreading amongst the rank and file will not be tolerated. Cool