Quote from: finlof on February 14, 2014, 07:21:05 PM

Quote from: MrTeal on February 14, 2014, 06:57:55 PM

Quote from: ab8989 on February 14, 2014, 04:11:00 PM

Quote from: kslaughter on February 14, 2014, 03:02:40 AM

It would have to be a redesign, but not much of one.

I am slightly wondering about the chip dimensions. You have stated that ActiveMining chip package dimensions are going to be 11mmx11mm. However I believe bitfury chip package dimensions are 7mmx7mm. The board seems fairly tightly packed with the 7x7mm chips. If you increase the size of package you would have to decrease the number of rows and columns of chips to make them fit. So I do not understand how this could be not much of a redesign as basically everything changes.

Changing the chip dimensions and even moving them around really isn't much of a change. It's a pretty simple respin of the board that wouldn't take more than a couple days, maybe one if you sat down and worked on it full time. As long as the interface and communications protocol is similar, the size of the chips is pretty much a non-factor.

his most recent post about the boards is that they would hold 24 ActM chips, not 32 chips like the board he has in the pictures. we all know Ken has posted pictures of "product" that are not representative of their final states. this appears to be one of those times.

I'm not trying to justify it, not knowing if the chips your engineers are using for prototyping are BFL or Bitfury is pretty strange. I'm just saying that a change in package size or even the number of chips isn't a big deal, so that doesn't invalidate what he said other than not knowing what chip it was. It could just be a stock image (though I've never seen the "Ultradense I-Card") or it could be what he said.