Quote from: Skot on Today at 04:08:16 PM

Quote from: developeralgo on Today at 04:01:39 PM

Quote from: Skot on Today at 03:41:03 PM

Quote from: developeralgo on Today at 03:22:27 PM

I just checked on some used BM1397AG I have; there is about 30Ω between the bottom GND pad and the top. I also checked on my last remaining new BM1397AG and it's more like 90Ω.

It is my understanding that the S17 has individual heatsinks for each chip because of this problem.

i have seen several refits for S17+ using a single large combed Heatsink plate for several chips all at once ( 3 large heatsinks per Hashboard ) . Not sure , how they get them to work

I have heard from a guy on our discord (you should join!) that in some cases they sand off the copper top.. I didn't believe it, but he has some pictures.

I think they could also use a electrically insulating but thermally conductive layer too.

which discord group ? i belong to a couple