Next scheduled rescrape ... never
Version 2
Last scraped
Scraped on 11/04/2025, 17:33:27 UTC
Hello guys,

Does anyone have experience with desoldering chips from S21? I'm curious how susceptible it is to the temperature profile of the IR station, or what was your yield when removing chips and using them in another device - e.g. bitaxe Gamma?
I have access to professional equipment, as well as experience with creating temperature profiles, etc.
Thx

If you're going to attempt any kind of rework on Bitmain ASICS, my advice is make sure you pre dry-bake >65°C the board or chips for 24-48 hours before carring out any rework.

The IC packages that Bitmain use for their ASICs are MSL3 and subject to moisture ingress. If you don't pre-bake they popcorn when you try and remove them from the board.
Version 1
Scraped on 11/04/2025, 17:08:32 UTC
Hello guys,

Does anyone have experience with desoldering chips from S21? I'm curious how susceptible it is to the temperature profile of the IR station, or what was your yield when removing chips and using them in another device - e.g. bitaxe Gamma?
I have access to professional equipment, as well as experience with creating temperature profiles, etc.
Thx

If you're going to attempt any kind of rework on Bitmain ASICS, my advice is make sure you pre dry-bake >65°C the board for 24-48 hours before carring out any rework.

The IC packages that Bitmain use for their ASICs are MSL3 and subject to moisture ingress. If you don't pre-bake they popcorn when you try and remove them from the board.
Original archived Re: Sourcing BM1370 ASIC Chip
Scraped on 11/04/2025, 17:03:15 UTC
Hello guys,

Does anyone have experience with desoldering chips from S21? I'm curious how susceptible it is to the temperature profile of the IR station, or what was your yield when removing chips and using them in another device - e.g. bitaxe Gamma?
I have access to professional equipment, as well as experience with creating temperature profiles, etc.
Thx

If you're going to attempt any kind of rework on Bitmain ASICS, my advice is make sure you pre dry-bake 65°C the board for 24-48 hours before carring out any rework.

The IC packages that Bitmain use for their ASICs are MSL3 and subject to moisture ingress. If you don't pre-bake they popcorn when you try and remove them from the board.