Update
Some details of BE300:
Process: tsmc 28nm hpc
Package: fclga (5mm x 5mm)
Normal Mode:
0.7v vdd
6gh/s per chip
8gh/s-12gh/s per chip for mass production
0.343w/g on chip
~0.3w/g on chip for mass production
Low Power Mode:
0.55v vdd
4.5gh/s per chip
6gh/s-9gh/s per chip for mass production
0.225w/g on chip
~0.2w/g on chip for mass production
The schedule of BE300 producing: First batch production will be done next Feb.
So these chips are smaller than the BE200, and also have fewer GH/s compared to the BE200, but are expected to have much better power efficiency.
Does this open up the possibility of putting these chips on USB sticks again? It seems that even two chips could be built into a usb stick and still have low enough power consumption.
On the flip slide, I expect this also means that the BE300 chips are not compatible with the BE200 chips with respect to pinouts and package, as friedcat stated would be likely, back in june?
Finally, I'm also confused regarding the difference in GH/s per chip and power consumption before and during mass production.
I would love to see usb miners again...
Those things sold like hotcakes...