The package turns from QFN to Flip-Chip-LGA,
Package propably will be the same.
These two are inherently incompatible statements

I was reffering to this:
...The MPW samples...final chips...
The ones that are mounted onto the boards in the pictures shown are the MPW samples, and they aren't FCLGA. If the production chips are to be FCLGA then it would make sense that the package is different between the MPW samples and final chips.