No offence here! Finally is just a question how they dice the wafers. Maybe it would be even wise, to have 4 dies 25 GH/s each in Multi-Chip-Package. But as you said, in sum they probably will have 100 GH/s per 120mm2.
Funny detail, the minimum count of wafers one can order at a foundry is 25 (1 lot)!
It's really a good question, why invest another $1.5M - $2M for a new 28nm full mask set for gen 2 ASIC if you dominate the market with gen 1?
The hypothesis does not offend ever. Also if you are well explained, like yours so appreciated.
It is important to know ETA chips. It seems that the request was not made in June.
I rely on package change after the 26th June.
https://www.kncminer.com/news/news-22
They say 2046 Balls & now say 2797 Balls
Why and when they decided to change the number of pads?
